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  3. IEC/PAS 60191-6-18 Ed. 1.0 en:2008 PDF

IEC/PAS 60191-6-18 Ed. 1.0 en:2008 PDF

IEC/PAS 60191-6-18 Ed. 1.0 en:2008 PDF

Name:
IEC/PAS 60191-6-18 Ed. 1.0 en:2008 PDF

Published Date:
01/22/2008

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publisher:
International Electrotechnical Commission - Publicly Available Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
iec-pas-60191-6-18-ed-1-0-en-2008_1536440
Choose Document Language:
29.10
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This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
Edition : 1.0
File Size : 1 file , 1 MB
Note : This product is unavailable in Canada
Number of Pages : 19
Published : 01/22/2008

History

IEC/PAS 60191-6-18 Ed. 1.0 en:2008
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
29.10 €

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