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  3. IEC/PAS 60191-6-19 Ed. 1.0 en:2008 PDF

IEC/PAS 60191-6-19 Ed. 1.0 en:2008 PDF

IEC/PAS 60191-6-19 Ed. 1.0 en:2008 PDF

Name:
IEC/PAS 60191-6-19 Ed. 1.0 en:2008 PDF

Published Date:
01/22/2008

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

Publisher:
International Electrotechnical Commission - Publicly Available Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
iec-pas-60191-6-19-ed-1-0-en-2008_1536441
Choose Document Language:
32.10
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This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.
Edition : 1.0
File Size : 1 file , 1.1 MB
Note : This product is unavailable in Canada
Number of Pages : 22
Published : 01/22/2008

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