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  3. IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

Name:
IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

Published Date:
05/30/2007

Status:
Active

Description:

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Publisher:
International Electrotechnical Commission - Publicly Available Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
iec-pas-61249-3-1-ed-1-0-en-2007_1504801
Choose Document Language:
69.00 €
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Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
Edition : 1.0
File Size : 1 file , 370 KB
Note : This product is unavailable in Canada
Number of Pages : 31
Published : 05/30/2007

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