Name: IEC/PAS 62137-3 Ed. 1.0 en:2008 PDF
Brand: International Electrotechnical Commission - Publicly Available Standard
SKU: iec-pas-62137-3-ed-1-0-en-2008_1588033
Price: 60.90 EUR
Availability: InStock

Name:
IEC/PAS 62137-3 Ed. 1.0 en:2008 PDF

Published Date:
11/13/2008

Status:
Active

Description:

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

Publisher:
International Electrotechnical Commission - Publicly Available Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Czech version):

200 business days

SKU:

iec-pas-62137-3-ed-1-0-en-2008_1588033

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

Edition :	1.0
File Size :	1 file , 1.5 MB
Note :	This product is unavailable in Canada
Number of Pages :	41
Published :	11/13/2008

IEC/PAS 62137-3 Ed. 1.0 en:2008 PDF

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

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