Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering - Guidelines for through hole diameter design with solder paste surface printing method

Publisher:
International Electrotechnical Commission - Technical Report

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This Part of IEC 61760 supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.

Edition :	1.0
File Size :	1 file , 2.2 MB
ISBN(s) :	9782832239285
Note :	This product is unavailable in Russia, Belarus, Ukraine, Canada
Number of Pages :	30
Published :	06/01/2022

IEC/TR 61760-3-1 Ed. 1.0 en:2022 PDF

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering - Guidelines for through hole diameter design with solder paste surface printing method

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