Name:
IEC/TR 61760-5-1 Ed. 1.0 en:2024 PDF
Published Date:
01/01/2024
Status:
Active
Publisher:
International Electrotechnical Commission - Technical Report
This document describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.
| Edition : | 1.0 |
| File Size : | 1 file , 4.5 MB |
| ISBN(s) : | 9782832281604 |
| Note : | This product is unavailable in Russia, Belarus, Ukraine, Canada |
| Number of Pages : | 28 |
| Published : | 01/01/2024 |
