IEC/TR 63357 Ed. 1.0 en:2022 PDF

IEC/TR 63357 Ed. 1.0 en:2022 PDF

Name:
IEC/TR 63357 Ed. 1.0 en:2022 PDF

Published Date:
10/01/2022

Status:
Active

Description:

Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles

Publisher:
International Electrotechnical Commission - Technical Report

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$28.5
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This Technical Report describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized.

Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.


File Size : 1 file , 1.6 MB
ISBN(s) : 9782832257661
Note : This product is unavailable in Russia, Belarus, Ukraine, Canada
Number of Pages : 18
Published : 10/01/2022

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