Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. INTERNATIONAL ORGANIZATION FOR STANDARDIZATION (TECHNICAL REPORT)
  3. ISO/TR 10200/AMD1:1997 PDF

ISO/TR 10200/AMD1:1997 PDF

ISO/TR 10200/AMD1:1997 PDF

Name:
ISO/TR 10200/AMD1:1997 PDF

Published Date:
05/01/1997

Status:
Active

Description:

Amendment 1 to ISO/TR 10200:1990

Publisher:
International Organization for Standardization (Technical Report)

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$12.9
Need Help?

File Size : 1 file , 300 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 4
Published : 05/01/1997

History

Related products

ISO/TR 12037:1998
ISO/TR 12037:1998
Published Date: 12/01/1998
Electronin imaging -- Recommendations for the expungement of information recorded on write-once optical media
$16.2

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1