The sole industry standard for determining appropriate internal and external conductor sizes on printed boards as a function of the current carrying capacity required and the acceptable conductor temperature rise. This document provides guidance on how thermal conductivity, vias, copper planes, power dissipation and printed board material and thickness all factor into the relationship between current, conductor size, and temperature.
| File Size : | 1
file
, 8.3 MB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 108 |
| Published : | 08/01/2009 |
