Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single, double or multi-layered boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters. This document should be used in conjunction with IPC- 2221.
| File Size : | 1
file
, 900 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 24 |
| Product Code(s) : | 2222(D)1 |
| Published : | 03/01/1998 |
