IPC 2225 PDF

This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.

ANSI :	ANSI Approved
File Size :	1 file , 590 KB
Note :	This product is unavailable in Russia, Ukraine, Belarus
Number of Pages :	44
Product Code(s) :	2225(D)1
Published :	05/01/1998