This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
| File Size : | 1
file
, 480 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 32 |
| Product Code(s) : | 3408(D)1 |
| Published : | 11/01/1996 |
