Name:
IPC 7092A PDF
Published Date:
10/01/2022
Status:
Active
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
| File Size : | 1 file , 8.2 MB |
| ISBN(s) : | 9781638160946 |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 124 |
| Product Code(s) : | 7092-STD-0-D-0-JP-A, 7092-STD-0-D-0-JP-A |
| Published : | 10/01/2022 |
