Name:
IPC 7095E PDF
Published Date:
08/01/2024
Status:
Active
This document describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, rework and reliability issues associated with design and assembly of printed boards using these packages.
| File Size : | 1 file , 17 MB |
| ISBN(s) : | 9781638161790 |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 208 |
| Product Code(s) : | 7095-STD-0-D-0-EN-E, 7095-STD-0-D-0-EN-E |
| Published : | 08/01/2024 |