1.1 Scope This document is intended to define standard
methods for the categorization of defects related to electronic
printed board assemblies (PBAs). This document
will provide consistent methodologies for calculating the
following benchmark indices:
Defects Per Million Opportunities Index (DPMO Index)
Component DPMO
Placement DPMO
Termination DPMO
Assembly DPMO
DPMO as applied in this standard is a measurement taken
on completed product. Only those defects detected or discovered
at an assemblys completed product evaluation are
to be included in the calculations. A companion standard,
IPC-9261 In-Process DPMO and Estimated Yield for PWAs
is used to develop DPMO indices for measuring in-process
assembly steps.
It is recognized that a manufacturing index can be obtained
through a variety of methods. Overall Manufacturing Index
(OMI) is explained in detail in Appendix B.
This document is intended to be used in conjunction with
assembly acceptance standards such as IPC/EIA J-STD-
001 or IPC-A-610. This document is for benchmarking and
is NOT intended to describe how to track or otherwise log
defect types or drive corrective action. In-process DPMO is
outside the scope of this document.
| ANSI : | ANSI Approved |
| File Size : | 1
file
, 250 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 24 |
| Product Code(s) : | 7912A(D)1, 7912A(D)1 |
| Published : | 01/01/2004 |
