This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.
| ANSI : | ANSI Approved |
| File Size : | 1
file
, 200 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 27 |
| Part of : | IPC M109, IPC 9500-K |
| Product Code(s) : | 9504(D)1 |
| Published : | 06/01/1998 |
