IPC D-859 PDF

Name:
IPC D-859 PDF

Published Date:
12/01/1989

Status:
Active

Description:

Design Standard for Thick Film Multilayer Hybrid Circuits

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities.

File Size :	1 file , 1 MB
Note :	This product is unavailable in Russia, Ukraine, Belarus
Number of Pages :	67
Product Code(s) :	D-859(D)1
Published :	12/01/1989

Published Date: 08/01/1995

Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

$19.5

Published Date: 01/10/1987

Specification for Multilayer Hybrid Circuits

$54.6

Published Date: 01/01/1987

Qualifications and Performance of Polymer Thick Film Printed Boards

$42.6

Published Date:

Standards and Specifications Manual - Four Volume Set - Two Year Subscription Included

$429.3