Name:
IPC J-STD-005B PDF
Published Date:
03/01/2024
Status:
Active
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is not intended to relate directly to the material’s performance in the assembly process. Solder paste users are referred to paragraph 6.3 for a listing of requirements information and options that should be addressed when procuring solder paste.
| ANSI : | ANSI Approved |
| File Size : | 1 file , 1.3 MB |
| ISBN(s) : | 9781638161707 |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 24 |
| Published : | 03/01/2024 |
