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IPC J-STD-013 PDF

IPC J-STD-013 PDF

Name:
IPC J-STD-013 PDF

Published Date:
08/01/1996

Status:
Active

Description:

Implementation of Ball Grid Array and Other High Density Technology

Publisher:
Association Connecting Electronics Industries

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$42.6
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This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.
File Size : 1 file , 1.3 MB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 123
Product Code(s) : J-013(D)1
Published : 08/01/1996

History

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