This document provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concerns of process engineers and others coming into the field of low-residue processes from two different areas: those who currently clean finished electronic assemblies using water-based semi-aqueous or other environmentally acceptable solvents and defluxing technologies; or those who use a standard residue level (SR) no-clean assembly process. Both types of manufacturers should understand the advantages and pitfalls of using low-residue soldering materials. This guide allows electronics manufacturers to choose the process/materials that will best suit their needs.
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Collaboration avec l'Organisation internationale de normalisation (ISO) et la Commission électrotechnique internationale (CEI) sur les techniques de la radiodiffusion
Colaboración con la Organización Internacional de Normalización (ISO) y la Comisión Electrotécnica Internacional (CEI) sobre tecnologías de radiodifusión
