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IPC TR-486 PDF

IPC TR-486 PDF

Name:
IPC TR-486 PDF

Published Date:
07/01/2001

Status:
Active

Description:

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Publisher:
Association Connecting Electronics Industries

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
ipc-tr-486_926795
Choose Document Language:
42.60 €
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This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used.
File Size : 1 file , 760 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 56
Product Code(s) : TR-486(D)1, TR-486(D)1
Published : 07/01/2001

History

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