IPC TR-579 PDF

IPC TR-579 PDF

Name:
IPC TR-579 PDF

Published Date:
09/01/1988

Status:
Active

Description:

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

Publisher:
Association Connecting Electronics Industries

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$42.6
Need Help?
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated.
File Size : 1 file , 2.9 MB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 80
Product Code(s) : TR-579(D)1
Published : 09/01/1988

History


Related products

IPC SM-785
Published Date: 11/01/1992
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
$42.6
IPC D-279
Published Date: 08/01/1996
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
$54.6
IPC M-105
Published Date:
Rigid Printed Board Manual
$207.9

Best-Selling Products

IEST Draft
Published Date:
Draft
IEST ESTECH17
Published Date: 06/01/2017
2017 ESTECH Presentations
$69.3
IEST ESTECH18
Published Date: 10/01/2018
2018 ESTECH Presentations
$69.3
IEST ESTECH19
Published Date: 06/01/2019
2019 ESTECH Presentations
$69.3
IEST ESTECH20
Published Date: 12/01/2020
2020 ESTECH Presentations
$69.3