BS ISO 15310:1999 PDF

BS ISO 15310:1999 PDF

Name:
BS ISO 15310:1999 PDF

Published Date:
02/15/2000

Status:
Active

Description:

Reinforced plastics. Determination of the in-plane shear modulus by the plate twist method

Publisher:
British Standard / International Organization for Standardization

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$24.384
Need Help?


Cross References: ISO 5725-1:1994*ISO 291:1997*ISO 1268:1974 *ISO 2602:1980*ISO 2818:1994*ISO 5893:1993 *
ISBN(s) : 0580359425
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 18
Product Code(s) : 30015802
Published : 02/15/2000

History


Related products

BS ISO 3597-3:2003
Published Date: 10/30/2003
Textile-glass-reinforced plastics. Determination of mechanical properties on rods made of roving-reinforced resin-Determination of compressive strength
$48.006

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1