ISO 15635:2001 PDF

ISO 15635:2001 PDF

Name:
ISO 15635:2001 PDF

Published Date:
04/01/2001

Status:
Active

Description:

Coated abrasives -- Flap discs

Publisher:
International Organization for Standardization

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$16.2
Need Help?

This International Standard specifies the nominal dimensions, tolerances and designations of flap discs.

It applies to flap discs intended for use on hand held grinding machines without support discs.


File Size : 1 file , 50 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 4
Published : 04/01/2001
Same As : ISO 15635:2001

History


Related products

ISO 525:2020
Published Date: 10/01/2020
Bonded abrasive products - Shape types, designation and marking
$49.8
ISO 603-14:2022
Published Date: 08/31/2022
Bonded abrasive products - Dimensions - Part 14: Grinding wheels for deburring and fettling/snagging on an angle grinder
$24.3
ISO 2976:2005
Published Date: 04/01/2005
Coated abrasives - Abrasive belts - Selection of width/length combinations
$37.2
ISO 6103:2014
Published Date: 10/01/2014
Bonded abrasive products - Permissible unbalances of grinding wheels as delivered - Static testing
$24.3

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1