Name:
ISO 9455-17:2002 PDF
Published Date:
12/15/2002
Status:
Active
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
| File Size : | 1 file , 880 KB |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 21 |
| Published : | 12/15/2002 |
| Same As : | ISO 9455-17:2002 |
