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ISO 9455-17:2002 PDF

ISO 9455-17:2002 PDF

Name:
ISO 9455-17:2002 PDF

Published Date:
12/15/2002

Status:
Active

Description:

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

Publisher:
International Organization for Standardization

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$47.1
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ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.


File Size : 1 file , 880 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 21
Published : 12/15/2002
Same As : ISO 9455-17:2002

History

ISO 9455-17:2024
ISO 9455-17:2024
Published Date: 01/01/2024
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
$49.8
ISO 9455-17:2002
ISO 9455-17:2002
Published Date: 12/15/2002
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
$47.1

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