JEDEC JEP131C PDF

JEDEC JEP131C applies to electronic components and subassemblies product and or process development, manufacturing processes and the associated performance requirements in customer applications. These areas should include, but are not limited to: package design, chip design, process development, assembly, fabrication, manufacturing, materials, quality, service, and suppliers, as well as the process requirements needed for the next assembly.

File Size :	1 file , 310 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	28
Published :	08/01/2018