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JEDEC JEP154 PDF

JEDEC JEP154 PDF

Name:
JEDEC JEP154 PDF

Published Date:
01/01/2008

Status:
Active

Description:

GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
jedec-jep154_1762491
Choose Document Language:
22.80 €
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This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.
File Size : 1 file , 370 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 34
Published : 01/01/2008

History

JEDEC JEP154A
JEDEC JEP154A
Published Date: 03/01/2024
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
JEDEC JEP154
JEDEC JEP154
Published Date: 01/01/2008
GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
22.80 €

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