JEDEC JESD 9-A PDF

JEDEC JESD 9-A PDF

Name:
JEDEC JESD 9-A PDF

Published Date:
04/01/1987

Status:
Active

Description:

METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS

Publisher:
JEDEC Solid State Technology Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$27.3
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This standard establishes the general requirements and quality assurance provisions that can be specified and met in procuring microelectronics packages and covers, manufactured from matched seal with and without high thermal conductivity base materials, intended for use in fabricating hybrid microelectronics circuits. This document details those minimum requirements necessary for metal packages' use exclusively.
File Size : 1 file , 810 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 55
Published : 04/01/1987

History

JEDEC JESD9C (R2023)
Published Date: 05/01/2017
Inspection Criteria for Microelectronic Packages and Covers
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JEDEC JESD9B
Published Date: 05/01/2011
Inspection Criteria for Microelectronic Packages and Covers
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JEDEC JESD 9-A
Published Date: 04/01/1987
METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS
$27.3

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