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JEDEC JESD 9-A PDF

JEDEC JESD 9-A PDF

Name:
JEDEC JESD 9-A PDF

Published Date:
04/01/1987

Status:
Active

Description:

METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$27.3
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This standard establishes the general requirements and quality assurance provisions that can be specified and met in procuring microelectronics packages and covers, manufactured from matched seal with and without high thermal conductivity base materials, intended for use in fabricating hybrid microelectronics circuits. This document details those minimum requirements necessary for metal packages' use exclusively.
File Size : 1 file , 810 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 55
Published : 04/01/1987

History

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JEDEC JESD 9-A
JEDEC JESD 9-A
Published Date: 04/01/1987
METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS
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