JEDEC JESD22-B116B PDF

This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.

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Number of Pages :	32
Published :	04/01/2017