JEDEC JESD22-B117B PDF

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

File Size :	1 file , 310 KB
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Number of Pages :	22
Published :	05/01/2014
Redline File Size :	2 files , 4 MB