JEDEC JESD22-B117B PDF

JEDEC JESD22-B117B PDF

Name:
JEDEC JESD22-B117B PDF

Published Date:
05/01/2014

Status:
Active

Description:

SOLDER BALL SHEAR

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

File Size :	1 file , 310 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	22
Published :	05/01/2014
Redline File Size :	2 files , 4 MB

History

JEDEC JESD22-B117B

JEDEC JESD22-B117B

Published Date: 05/01/2014

SOLDER BALL SHEAR

$18.6

JEDEC JESD22-B117A

JEDEC JESD22-B117A

Published Date: 10/01/2006

SOLDER BALL SHEAR

$16.8

Related products

Best-Selling Products

ASQ/IEC D60300-3-1-1997

ASQ/IEC D60300-3-1-1997

Published Date: 09/16/1997

Dependability Management - Part 3:Application Guide - Section 1 - Analysis Techniques for Dependability

$10.5

ASQ/IEC D60300-3-2-1997

ASQ/IEC D60300-3-2-1997

Published Date: 09/16/1997

Dependability Management - Part 3:Application Guide - Collection of Dependability Data

$10.5

ASQ/IEC D61070-1997

ASQ/IEC D61070-1997

Published Date: 09/16/1997

Compliance Test Procedures for Steady-State Availability

$10.5

ASQ/IEC D61078-1997

ASQ/IEC D61078-1997

Published Date: 09/16/1997

Analysis Techniques for Dependability - Reliability Block Diagram Method

$10.5

ASQ/IEC D61123-1997

ASQ/IEC D61123-1997

Published Date: 09/16/1997

Reliability Testing - Compliance Plans for Success Ratio

$10.5

ASQ/IEC D61164-1997

ASQ/IEC D61164-1997

Published Date: 09/16/1997

Reliability Growth - Statistical Test and Estimation Methods

$10.5