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JEDEC JESD51-14 PDF

JEDEC JESD51-14 PDF

Name:
JEDEC JESD51-14 PDF

Published Date:
11/01/2010

Status:
Active

Description:

INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$24
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This document specifies a test method (referred to herein as "Transient Dual Interface Measurement") to determine the conductive thermal resistance "Junction-to-Case" R0JC (0JC) of semiconductor devices with a heat flow through a single path, i.e., semiconductor devices with a high conductive heat flow path from the die surface that is heated to a package case surface that can be cooled by contacting it to an external heat sink.
File Size : 1 file , 670 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Published : 11/01/2010

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