JEDEC JESD59 PDF

Name:
JEDEC JESD59 PDF

Published Date:
06/01/1997

Status:
Active

Description:

BOND WIRE MODELING STANDARD

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

File Size :	1 file , 260 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	16
Published :	06/01/1997

History

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JEDEC JESD59 PDF

BOND WIRE MODELING STANDARD

History

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