JEDEC JESD59 PDF

Name:
JEDEC JESD59 PDF

Published Date:
06/01/1997

Status:
Active

Description:

BOND WIRE MODELING STANDARD

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

File Size :	1 file , 260 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	16
Published :	06/01/1997

History

Related products

JEDEC JEP119A

Published Date: 08/01/2003

A PROCEDURE FOR EXECUTING SWEAT

$22.2

JEDEC JEP123

Published Date: 10/01/1995

GUIDELINE FOR MEASUREMENT OF ELECTRONIC PACKAGE INDUCTANCE AND CAPACITANCE MODEL PARAMETERS

$18.6

JEDEC JEP126

Published Date: 05/01/1996

GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYSIS

$14.4

JEDEC JESD 35-2

Published Date: 02/01/1996

ADDENDUM No. 2 to JESD35 - TEST CRITERIA FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS

$16.2

Best-Selling Products

IFAI CPAI-75

Published Date:

Rate of Burn Specifications for Sleeping Bags

$60

IFAI CPAI-84

Published Date: 01/01/2021

Specification for Flame-resistant Materials Used in Camping Tentage

IFAI MARINE FABRICATOR DESIGN

Published Date:

Marine Fabricator Design & Fabrication Manual

$17.4

IFAI STATE OF THE INDUSTRY

Published Date: 01/01/2021

State of the Industry

$187.8

IFAI USIFI-DTL 55308A

Published Date: 03/16/2010

Detail Specification — Cloth and Strip, Laminated or Coated, Vinyl, Reinforced, High Strength, Flexible

$37.2