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JIS C 60068-2-69:2019 PDF

JIS C 60068-2-69:2019 PDF

Name:
JIS C 60068-2-69:2019 PDF

Published Date:
01/01/2019

Status:
Active

Description:

Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Publisher:
Japanese Industrial Standard / Japanese Standards Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$34.8
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JIS C 60068-2-69:2019 outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations on electronic components and printed boards. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.
File Size : 1 file , 640 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 61
Published : 01/01/2019

History

JIS C 60068-2-69:2019
JIS C 60068-2-69:2019
Published Date: 01/01/2019
Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
$34.8
JIS C 60068-2-69:2009
JIS C 60068-2-69:2009
Published Date: 01/01/2009
Environmental testing -- Part 2-69: Tests -- Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (Foreign Standard)
$52.2

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