JIS H 8302:2004 PDF

JIS H 8302:2004 PDF

Name:
JIS H 8302:2004 PDF

Published Date:
01/01/2004

Status:
Active

Description:

Build-up thermal spraying

Publisher:
Japanese Industrial Standard / Japanese Standards Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$6.3
Need Help?

File Size : 1 file , 430 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Published : 01/01/2004

History

JIS H 8302:2010
Published Date: 01/01/2010
Build-up thermal spraying
$19.2
JIS H 8302:2004
Published Date: 01/01/2004
Build-up thermal spraying
$6.3

Related products

JIS B 4134:1994
Published Date: 01/01/1994
Single point diamond dressing tools
$8.7
JIS B 6011:2004
Published Date: 01/01/2004
Machine tools -- Direction of operation of controls
$16.2
JIS G 0601:2012
Published Date: 01/01/2012
Testing methods for clad steels
$19.2
JIS H 8601:1999
Published Date: 01/01/1999
Anodic oxide coatings on aluminium and aluminium alloys
$22.5

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1