Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition PDF

Abstract:

A thoroughly revised, comprehensive guide to microelectronic device and systems packaging.

This fully updated resource offers complete coverage of the latest microelectronic device and systems packaging methods and applications. The book lays the groundwork for Moore's Law for packaging by showing how I/Os have evolved from one package family node to the next—from fewer than 16 I/Os in the 1960s to the current silicon interposers with about 200,000 I/Os. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, proposes a variety of ways to extend Moore's Law, including maximizing Si interposers and implementing glass panel embedding. You will get detailed discussions of cutting-edge technologies, including 3D opto-electronics and, ultimately, quantum computing, that could become the next Moore's Law.

Coverage includes:

• Electrical design for signals, power, and electromagnetic interference

• Thermal technologies and thermo-mechanical reliability

• Package materials at microscale and nanoscale

• Ceramic, organic, glass, and silicon substrates

• Passive components and integration with active devices

• Chip-to-package interconnections and assembly

• Embedded and fan-out packaging

• 3D packaging with TSV and RF and millimeter-wave packaging

• Optoelectronics, MEMS, and sensor packaging

• Package encapsulation, molding, and sealing

• Printed wiring boards and board assembly

• Future car electronics, bioelectronics, and communication applications

• Computer packaging, flexible electronics, and smartphone applications

• Mechanical design for reliability

Author: Dr. Rao R. Tummala