FED J-W-1177B PDF

FED J-W-1177B PDF

Name:
FED J-W-1177B PDF

Published Date:
06/10/1988

Status:
[ Withdrawn ]

Description:

WIRE, MAGNET, ELECTRICAL, GENERAL SPECIFICATION (S/S BY NEMA-MW-1000-1997) (SUPERSEDING J-W-1177A)

Publisher:
Federal Specifications and Standards

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$8.7
Need Help?

File Size : 1 file , 2.9 MB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 25
Published : 06/10/1988

History


Related products

MIL DESC 84020B
Published Date: 04/10/1989
CABLES, ELECTRICAL, ALUMINUM FOIL SHIELDED PAIRS 22 GAUGE - 10 PAIRS OF CONDUCTORS
$7.2
MIL MIL-DTL-17/130F
Published Date: 07/26/2006
CABLES, RADIO FREQUENCY, COAXIAL, 0.141 INCH (3.58 MM) DIAMETER, SEMIRIGID, 50 OHMS(SUPERSEDING MIL-C-17/130E)
$7.2
MIL MIL-C-17/213
Published Date: 09/29/1993
CABLES, RADIO FREQUENCY, FLEXIBLE COAXIAL, 50 OHMS, M17/213-00001
$7.2
MIL MIL-C-24643/52D
Published Date: 11/22/1994
CABLE, ELECTRICAL, 300 VOLTS, TYPE LSTPNW (INCLUDING VARIATION LSTPNWA) (SUPERSEDING MIL-C-24643/52C) (S/S BY MIL-DTL-24643/52E)
$7.2

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1