MIL MIL-C-85485/6 PDF

MIL MIL-C-85485/6 PDF

Name:
MIL MIL-C-85485/6 PDF

Published Date:
05/10/1983

Status:
Active

Description:

CABLE, ELECTRIC, FILTER LINE, COMPONENT WIRE, SILVER-COATED HIGH STRENGTH COPPER ALLOY CONDUCTOR, RADIO FREQUENCY ABSORPTIVE, 150 DEG. C, 600-VOLT

Publisher:
Military Specifications and Standards

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$7.2
Need Help?

File Size : 1 file , 130 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 3
Published : 05/10/1983

History


Related products

QPL QPL-49055-24
Published Date: 03/15/2006
CABLES, POWER, ELECTRICAL, (FLEXIBLE, FLAT, UNSHIELDED), (ROUND CONDUCTOR) GENERAL SPECIFICATION FOR(SUPERSEDING QPL-49055-23)
$7.2
MIL MIL-C-17/107 Notice 1 - Cancellation
Published Date: 11/15/1977
CABLE, RADIO FREQUENCY, COAXIAL TYPE RG-280/U (NO S/S DOCUMENT)
$7.2
MIL MIL-C-17/76A Notice 1 - Cancellation
Published Date: 04/27/1979
CABLE, RADIO FREQUENCY, COAXIAL, RG-215/U (S/S BY MIL-C-17/74)
$7.2

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1