MIL MIL-DTL-3628/143B PDF

Published Date: 06/21/2019

Badge, Identification, Joint Chief of Staff

Published Date: 08/05/2014

Badge, Identification, Joint Chief of Staff

Published Date: 11/15/1996

BADGE, IDENTIFICATION, JOINT CHIEFS OF STAFF (SUPERSEDING MIL-B-41809/2G)

Published Date: 10/12/1995

SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON TYPES 2N702, AND 2N703 (NO S/S DOCUMENT) (SUPERSEDING MIL-S-19500/153A)

Published Date: 03/15/1988

SINGLE AND MULTILEVEL CONTINUOUS SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES (NO S/S DOCUMENT) (SUPERSEDING MIL-STD-1235B AND MIL-HDBK-106)

Published Date: 02/25/2013

Headset-Microphone Kit, MK-1564( )/AIC

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage