MIL MIL-HDBK-29612/2A PDF

Published Date: 08/31/2001

INSTRUCTIONAL SYSTEMS DEVELOPMENT/SYSTEMS APPROACH TO TRAINING AND EDUCATION (PART 2 OF 5 PARTS)

Published Date: 07/30/1999

INSTRUCTIONAL SYSTEMS DEVELOPMENT/SYSTEMS APPROACH TO TRAINING AND EDUCATION (SUPERSEDING MIL-HDBK-1379/2) (S/S BY MIL-HDBK-29612/2A)

Published Date: 06/04/1985

TECHNICAL REVIEWS AND AUDITS FOR SYSTEMS, EQUIPMENTS, AND COMPUTER SOFTWARE (FUNCTIONAL CONFIGURATION AUDIT AND PHYSICAL CONFIGURATION AUDIT REQUIREMENTS WERE INCORPORATED INTO MIL-STD-973, NO S/S DOCUMENT FOR ALL OTHER AREAS) (SUPERSEDING MIL-STD-1521A)

Published Date: 06/10/2005

FAILURE RATE SAMPLING PLANS AND PROCEDURES (SUPERSEDING MIL-STD-690C)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage