MIL MIL-M-38510/21F PDF

Published Date: 02/15/2006

MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, LOW POWER, FLIP-FLOPS, MONOLITHIC SILICON (SEE BASE FOR INACTIVATION NOTICE)(SUPERSEDING MIL-M-38510/21E)

Published Date: 07/07/2005

MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, LOW POWER, FLIP-FLOPS, MONOLITHIC SILICON (SEE BASE FOR INACTIVATION NOTICE) (SUPERSEDING MIL-M-38510/21D)(S/S BY MIL-M-38510/21F)

Published Date: 01/04/1988

MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, LOW POWER, FLIP-FLOPS MONOLITHIC SILICON (SUPERSEDING MIL-M-38510/21C) (S/S BY MIL-M-38510/21E)

Published Date: 03/03/1989

MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX INVERTERS, MONOLITHIC SILICON(S/S BY DSCC 5962-88718B)

Published Date: 09/17/1993

MICROCIRCUIT, LINEAR, VOLTAGE REGULATOR, SWITCHING, MONOLITHIC SILICON

Published Date: 10/13/1992

MICROCIRCUIT, MEMORY, DIGITAL, CMOS 8 - MACROCELL ELECTRICALLY PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON

Published Date: 10/29/1993

MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512 X 9 PARALLEL FIFO, MONOLITHIC SILICON

Published Date: 12/01/1975

Test methods for metallic materials - Part 3 : Load calibration of tensile testing machines

Published Date: 01/31/2000

Metallic materials - Test methods - Part 6 : Bend testing

Published Date: 05/31/1991

Test methods for metallic materials - Tube used under pressure - Part 17 : Integrity test

Published Date: 05/31/1991

Test methods for metallic materials - Part 18 : Hydraulic distension test for tube

Published Date: 02/29/1996

Test methods for metallic materials - Part 20: Eddy current testing of circular cross-section tubes

Published Date: 01/31/2000

Metallic materials - Test methods - Part 21 : Radiographic testing of castings