MIL MIL-M-38510/323D PDF

Published Date: 07/14/2003

MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, QUADRUPLE BUS BUFFER GATES WITH THREE STATE OUTPUTS, MONOLITHIC SILICON (SEE BASE FOR INACTIVATION NOTICE) (SUPERSEDING MIL-M-38510/323C)

Published Date: 08/07/1987

MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, QUADRUPLE BUS BUFFER GATES WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON (SUPERSEDING MIL-M-38510/323B) (S/S BY MIL-M-38510/323D)

Published Date: 04/06/1992

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCE SCHOTTKY TTL, MULTI-MODE BUFFERED LATCH, INV. (THREE-STATE), MONOLITHIC SILICON (SUPERSEDING DESC 5962-90585)

Published Date: 06/04/2004

MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 8K X 8-BIT EEPROM, MONOLITHIC SILICON (SUPERSEDING DSCC 5962-87514C)

Published Date: 06/05/2006

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, 8-BIT UNIVERSAL REGISTER, MONOLITHIC SILICON(SUPERSEDING DESC 5962-89573B)

Published Date: 05/15/2007

MICROCIRCUIT, LINEAR, CMOS, FIXED/ADJUSTABLE, LOW POWER, STEP-UP, SWITCHING REGULATOR, MONOLITHIC SILICON(SUPERSEDING DSCC 5962-92141A)

Published Date: 12/01/1975

Test methods for metallic materials - Part 3 : Load calibration of tensile testing machines

Published Date: 01/31/2000

Metallic materials - Test methods - Part 6 : Bend testing

Published Date: 05/31/1991

Test methods for metallic materials - Tube used under pressure - Part 17 : Integrity test

Published Date: 05/31/1991

Test methods for metallic materials - Part 18 : Hydraulic distension test for tube

Published Date: 02/29/1996

Test methods for metallic materials - Part 20: Eddy current testing of circular cross-section tubes

Published Date: 01/31/2000

Metallic materials - Test methods - Part 21 : Radiographic testing of castings