MIL MIL-PRF-19500/312E PDF

Published Date: 08/12/2015

Transistor, NPN, Silicon, Switching, through-Hole Package and Unencapsulated Die, Type 2N708, Quality Levels JAN, JANTX, and JANHC

Published Date: 03/30/2006

SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, SWITCHING, TYPE 2N708, JAN, JANTX, AND JANHC (SEE BASE FOR INACTIVATION NOTICE)(SUPERSEDING MIL-PRF-19500/312D)

Published Date: 02/20/2001

SEMICONDUTOR DEVICE, TRANSISTOR, NPN, SILICON, SWITCHING, TYPE 2N708, JAN, JANTX AND JANHC(SUPERSEDING MIL-PRF-19500/312C)(S/S BY MIL-PRF-19500/312E)

Published Date: 07/24/2020

Rectifier, Semiconductor Devices, Silicon, Voltage Regulator, Encapsulated Through-Hole and Surface Mount Packages, Device Types 1N4460 Through 1N4496, and 1N6485 Through 1N6491, Quality Levels JAN, JANTX, JANTXV, and JANS

Published Date: 03/09/1970

SEMICONDUCTOR DEVICE, THYRISTORS, (CONTROLLED RECTIFIERS) SILICON TPES 2N2024, 2N2025, 2N2027, 2N2029, 2N2030 (S/S BY MIL-S-19500/203D)

Published Date: 03/01/1999

SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, GERMANIUM, LOW-POWER, TYPES 2N43AZ1, 2N43AZ2, 2N44AZ1 AND 2N44AZ2 (SUPERSEDING MIL-S-19500/6B)

Published Date: 12/01/1975

Test methods for metallic materials - Part 3 : Load calibration of tensile testing machines

Published Date: 01/31/2000

Metallic materials - Test methods - Part 6 : Bend testing

Published Date: 05/31/1991

Test methods for metallic materials - Tube used under pressure - Part 17 : Integrity test

Published Date: 05/31/1991

Test methods for metallic materials - Part 18 : Hydraulic distension test for tube

Published Date: 02/29/1996

Test methods for metallic materials - Part 20: Eddy current testing of circular cross-section tubes

Published Date: 01/31/2000

Metallic materials - Test methods - Part 21 : Radiographic testing of castings