Name:
MIL MIL-PRF-31032/1C (all prev amd incorp.) PDF

Published Date:
05/23/2010

Status:
Active

Description:

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Publisher:
Military Specifications and Standards

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1).

File Size :	1 file , 530 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	31
Published :	05/23/2010

History

MIL MIL-PRF-31032/1D

Published Date: 06/01/2017

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

$8.7

MIL MIL-PRF-31032/1C (all prev amd incorp.)

Published Date: 05/23/2010

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

$7.2

MIL MIL-PRF-31032/1B

Published Date: 10/29/2004

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/1A)

$7.2

MIL MIL-PRF-31032/1A

Published Date: 06/22/1999

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/1) (S/S BY MIL-PRF-31032/1B)

$7.2

MIL MIL-PRF-31032/1

Published Date: 11/01/1995

PRINTED WIRING BOARD, RIGID, MULTILAYERED, WOVEN E-GLASS REINFORCED THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (S/S BY MIL-PRF-31032/1A)

$7.2

Related products

MIL MIL-PRF-1/889J Amendment 2 (all prev amd incorp.)

Published Date: 06/09/2009

Electron Tube, Power Types 7203 and 7203A

$3.6

MIL MIL-PRF-19500/168L

Published Date: 03/18/2019

Semiconductor Device, Thyristors (Controlled Rectifiers), Silicon, Types 2N1771A, 2N1772A, 2N1774A, 2N1776A, 2N1777A, 2N1778A, and 2N2619A, JAN, JANTX, and JANTXV

$3.6

Best-Selling Products

BS ISO/IEC ISP 10607-1:1995

Published Date: 03/15/1997

Information technology. International standardized profiles AFTnn. File transfer, access and management-Specification of ACSE, presentation and session protocols for the use by FTAM

$57.15

BS ISO/IEC ISP 10608-14:1995

Published Date: 12/15/1995

Information technology. International standardized profile TAnnnn. Connection-mode transport service over connectionless-mode network service-MAC, PHY and PMD sublayer dependent and Station Management requirements over an FDDI LAN subnetwork

$79.248

BS ISO/IEC ISP 10608-5:1992

Published Date: 03/15/1994

Information technology. International standardized profile TAnnnn. Connection-mode transport service over connectionless-mode network service-TA1111/TA1121 profiles including subnetwork-dependent requirements for X.25 packet-switched data networks using virtual calls

$48.006

BS ISO/IEC ISP 10609-1:1992

Published Date: 01/15/1993

Information technology. International standardized profiles TB, TC, TD and TE. Connection-mode transport service over connection-mode network service-Subnetwork-type independent requirements for Group TB

$57.15

BS ISO/IEC ISP 10609-5:1992

Published Date: 01/15/1993

Information technology. International standardized profiles TB, TC, TD and TE. Connection-mode transport service over connection-mode network service-Definition of profiles TB1111/TB1121

$28.194

BS ISO/IEC ISP 10614-1:1995

Published Date: 11/15/1995

Information technology. International standardized profile RC. X.25 protocol relaying-Subnetwork-independent requirements

$57.15