MIL MIL-PRF-31032/1C (all prev amd incorp.) PDF

MIL MIL-PRF-31032/1C (all prev amd incorp.) PDF

Name:
MIL MIL-PRF-31032/1C (all prev amd incorp.) PDF

Published Date:
05/23/2010

Status:
Active

Description:

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Publisher:
Military Specifications and Standards

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$7.2
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This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1).
File Size : 1 file , 530 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 31
Published : 05/23/2010

History

MIL MIL-PRF-31032/1D
Published Date: 06/01/2017
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
$8.7
MIL MIL-PRF-31032/1C (all prev amd incorp.)
Published Date: 05/23/2010
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
$7.2
MIL MIL-PRF-31032/1B
Published Date: 10/29/2004
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/1A)
$7.2
MIL MIL-PRF-31032/1A
Published Date: 06/22/1999
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/1) (S/S BY MIL-PRF-31032/1B)
$7.2
MIL MIL-PRF-31032/1
Published Date: 11/01/1995
PRINTED WIRING BOARD, RIGID, MULTILAYERED, WOVEN E-GLASS REINFORCED THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (S/S BY MIL-PRF-31032/1A)
$7.2

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