MIL MIL-STD-1323-149A PDF

Name:
MIL MIL-STD-1323-149A PDF

Published Date:
06/07/1989

Status:
Active

Description:

UNIT LOAD FOR UNDERWAY REPLENISHMENT 16 INCH 50 CAL. H.C./H.E. PROJECTILE MK 13 AND MK 19 IN PALLET ADAPTER MK 88 MOD 0 (SUPERSEDING MIL-STD-1323/149)

Publisher:
Military Specifications and Standards

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

File Size :	1 file , 130 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	5
Published :	06/07/1989

History

Related products

MIL MIL-STD-1323-305

Published Date: 11/18/1988

UNIT LOAD FOR UNDERWAY REPLENISHMENT BLU-80/B BALLONETTE IN CONTAINER, CNU-388/E

$7.2

MIL MIL-STD-1323-344

Published Date: 01/11/1988

UNIT LOAD FOR UNDERWAY REPLENISHMENT AIRBOCS, AN/SLQ-3 CHAFF BUE ELECTRONIC BUOYS IN PALLET CRATE, CNU-313/E

$7.2

MIL MIL-STD-1323/294 Notice 1 - Cancellation

Published Date: 01/25/2006

TRUCKLOADING OF AMMUNTION AND EXPLOSIVES(S/S BY NAVSEA-6214082)

$7.2

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

$12.6

IEC/PAS 60050-732 Ed. 1.0 b:2007

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

$61.2

IEC/PAS 60092-510 Ed. 1.0 en:2009

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

$89.7

IEC/PAS 60099-7 Ed. 1.0 en:2004

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

$95.1

IEC/PAS 60191-6-18 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

$29.1

IEC/PAS 60191-6-19 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

$32.1