MIL MIL-STD-202/219 PDF

The purpose of this test is to determine the integrity of materials and procedures used to attach surface mounted chip components to package headers or other substrates. This determination is based on a measure of force applied to the chip components, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization.

File Size :	1 file , 89 KB
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Number of Pages :	6
Published :	09/11/2017