MIL MS25272K PDF

Published Date: 11/27/2012

Relays, Electromagnetic, 10 Amperes, 4 PDT, Type I, Potted Lead, Hermetically Sealed

Published Date: 11/27/2003

RELAYS, ELECTROMAGNETIC, 10 AMPERES, 4 PDT, TYPE I, POTTED LEAD, HERMETICALLY SEALED (SEE BASE FOR INACTIVATION NOTICE) (SUPERSEDING MS25272H)

Published Date: 01/20/1989

RELAYS, ELECTROMAGNETIC, 10 AMPERES, 4 PDT, TYPE I, POTTED LEAD, HERMETICALLY SEALED (SUPERSEDING MS25272G) (S/S BY MS25272J)

Published Date: 06/30/2006

MICROCIRCUIT, HYBRID, DIGITAL, FLASH, ERASABLE/PROGRAMMABLE READ ONLY MEMORY, 128K X 32-BIT(SUPERSEDING DSCC 5962-94610B)

Published Date: 09/28/2015

Hook, Slip, Eye, with Latch

Published Date: 09/01/1995

Standard Conditions for Use Prior to and During the Testing of Solid Electrical Insulating Materials - GERMAN ONLY

Published Date: 08/01/1995

Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods - Part 2: General Examination, Electrical Continuity and Contact Resistance Tests, Insulation Tests and Voltage Stress Tests - GERMAN ONLY

Published Date: 05/01/1994

Electromechanical Components for Eelectronic Equipment; Basic Testing Procedures and Measuring Methods; Part 2: General Examination, Electrical Continuity and Contact Resistance Tests, Insulation Tests and Voltage Stress Tests - GERMAN ONLY

Published Date: 05/01/1994

Electromechanical Components for Electronic Equipment; Basic Testing Procedures and Measuring Methods; Part 3: Current-Carrying Capacity Tests - GERMAN ONLY

Published Date: 05/01/1994

Electromechanical Components for Electronic Equipment; Basic Testing Procedures and Measuring Methods; Part 4: Dynamic Stress Tests - GERMAN ONLY

Published Date: 05/01/1994

Electromechanical Components for Electronic Equipment; Basic Testing Procedures and Measuring Methods; part 5: Impact Tests (Free Components), Static Load Tests (Fixed Components), Endurance Tests and Overload Tests - GERMAN ONLY