QPL QPL-22052-22 PDF

Published Date: 01/24/2005

VALVE, STOP AND STOP CHECK, GLOBE, ANGLE, AND Y PATTERN, CAST OR FORGED CARBON OR ALLOY STEEL, OUTSIDE SCREW AND YOKE (SIZES 2-1/2 INCHES AND LARGER) (SUPERSEDING QPL-22052-26)

Published Date: 05/12/2003

QUALIFIED PRODUCTS LIST OF PRODUCTS QUALIFIED UNDER MILITARY SPECIFICATION MIL-V-22052 (SUPERSEDING QPL-22052-25) (S/S BY QPL-22052-27)

Published Date: 11/03/2000

VALVES, STOP AND STOP CHECK, GLOBE, ANGLE, AND Y PATTERN, CAST OR FORGED CARBON OR ALLOY STEEL, OUTSIDE SCREW AND YOKE (SIZES 2-1/2 INCHES AND LARGER) (SUPERSEDING QPL-22052-24) (S/S BY QPL-22052-26)

Published Date: 04/06/2000

VALVES, STOP AND STOP CHECK, GLOBE, ANGLE, AND Y PATTERN, CAST OR FORGED CARBON OR ALLOY STEEL, OUTSIDE SCREW AND YOKE (SIZES 2-1/2 INCHES AND LARGER) (SUPERSEDING QPL-22052-23) (S/S BY QPL-22052-25)

Published Date: 08/31/1998

VALVES, STOP AND STOP CHECK, GLOBE, ANGLE, AND Y PATTERN, CAST OR FORGED CARBON OR ALLOY STEEL, OUTSIDE SCREW AND YOKE (SIZES 2-1/2 INCHES AND LARGER) (SUPERSEDING QPL-22052-22) (S/S BY QPL-22052-24)

Published Date: 06/19/1995

VALVES, STOP AND STOP CHECK, GLOBE, ANGLE, AND Y PATTERN, CAST OR FORGED CARBON OR ALLOY STEEL, OUTSIDE SCREW AND YOKE (SIZES 2-1/2 INCHES AND LARGER) (SUPERSEDING QPL-22052-21) (S/S BY QPL-22052-23)

Published Date: 09/30/1964

VALVE, HIGH PRESSURE OXYGEN CHECK, FLARELESS ENDS (NO S/S DOCUMENT)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage