MODUK DEF STAN 81-74 PDF

This standard specifies the requirement for the packaging of robust semiconductor devices including electrostatic discharge sensitive items to Military Levels P, N and J.

Only devices with a minimum fragility factor of 100 g_n, and a Primary Package Quantity (PPQ) of one are covered by this standard. When the contract specifies a PPQ greater than one, the Services Packaging Instruction Sheet (SPIS) shall follow the principles of this standard.