NASA GSFC S-311-P-079 PDF

NASA GSFC S-311-P-079 PDF

Name:
NASA GSFC S-311-P-079 PDF

Published Date:
02/23/1996

Status:
Active

Description:

THERMOFOIL HEATER, PROCUREMENT SPECIFICATION FOR

Publisher:
National Aeronautics and Space Administration

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$3.6
Need Help?

Edition : E
File Size : 1 file , 630 KB
Number of Pages : 12
Published : 02/23/1996

History


Related products

NASA SSTD-8070-0138-ELEC Rev B.
Published Date: 08/18/2020
Arc Flash Standard, Revision (20-08-18)
$8.7
NASA STD-5020B
Published Date: 08/06/2021
Requirements for Threaded Fastening Systems in Spaceflight Hardware
$17.4
NASA MSFC-HDBK-3684 Rev. A
Published Date: 09/25/2017
Project Planning and Control Handbook
$21.6
NASA SSTD-8070-0115-MISC Rev. B
Published Date: 07/01/2019
Office Trailer Tie-Downs, Blocking & Electrical Connections
$8.7

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1