The purpose of this specification is to present in detail the test requirement and procedures necessary for the thermal vacuum bakeout of "contamination sensitive hardware". These requirements and procedures as defined within this specification provide the methodology to achieve an acceptable level of molecular outgassing from components, subsystems, and totally assembled systems; and the verification that these levels have been achieved. This document generally follows the ASTM E2900 method for thermal vacuum bakeout, method C, with optical witness sample(s) in lieu of or in addition to nonvolatile residue (NVR) witness plates.
| Edition : | B |
| File Size : | 1
file
, 110 KB |
| Number of Pages : | 13 |
| Published : | 01/10/2020 |
